Conductive path in switching material in a resistive random access memory device and control

ABSTRACT

A non-volatile memory device structure. The device structure includes a first electrode, a second electrode, a resistive switching material comprising an amorphous silicon material overlying the first electrode, and a thickness of dielectric material having a thickness ranging from 5 nm to 10 nm disposed between the second electrode and the resistive switching layer. The thickness of dielectric material is configured to electrically breakdown in a region upon application of an electroforming voltage to the second electrode. The electrical breakdown allows for a metal region having a dimension of less than about 10 nm by 10 nm to form in a portion of the resistive switching material.

CROSS REFERENCE TO RELATED APPLICATIONS

Not Applicable

STATEMENT RELATED TO GOVERNMENT OR FEDERAL SPONSORED RESEARCH

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BACKGROUND

The present invention is related to switching devices. More particularly, the present invention is provides a resistive switching device characterized by a reduced forming voltage and a low leakage current. Embodiments of the present invention have been applied to fabrication and operation of a resistive random access memory device. But it should be recognized that the present invention can have a much broader range of applicability.

The success of semiconductor devices has been mainly driven by an intensive transistor down-scaling process. However, as field effect transistors (FET) approach sizes less than 100 nm, problems such as short channel effect can degrade device performance. Moreover, such sub 100 nm device size can lead to sub-threshold slope non-scaling and also increases power dissipation. It is generally believed that transistor-based memories such as those commonly known as Flash may approach an end to scaling within a decade. Flash memory is one type of non-volatile memory device.

Other non-volatile random access memory devices such as ferroelectric RAM (Fe RAM), magneto-resistive RAM (MRAM), organic RAM (ORAM), and phase change RAM (PCRAM), among others, have been explored as next generation memory devices. These devices often require new materials and device structures to couple with silicon-based devices to form a memory cell, which lack one or more key attributes. For example, Fe-RAM and MRAM devices have fast switching characteristics and good programming endurance, but their fabrication is not CMOS compatible and size is usually large. Switching for a PCRAM device requires large amounts of power. Organic RAM or ORAM is incompatible with large volume silicon-based fabrication and device reliability is usually poor.

From the above, a new semiconductor device structure and integration is desirable.

BRIEF SUMMARY OF THE PRESENT INVENTION

The present invention is related to switching devices. More particularly, the present invention is provides a resistive switching device characterized by a low forming voltage and a low leakage current. Embodiments of the present invention have been applied to fabrication and operation of a resistive random access memory (RRAM) device. But it should be recognized that the present invention can have a much broader range of applicability.

In a specific embodiment, a resistive switching device is provided. The resistive switching device includes a first electrode, a switching material, and a second electrode. In a specific embodiment, the resistive switching device includes a thickness of dielectric material disposed between the second electrode and the switching material. The thickness of dielectric material is configured to electrically breakdown in a region and cause formation of an open region in a portion of the thickness of dielectric material when a first voltage is applied to the second electrode. The open region has a first dimension to allow a metal region to form from the metal material within the portion of the thickness of dielectric material. The metal region further extends into a portion of the resistive switching material in a vicinity of the second electrode. The first voltage is a positive biased voltage in a specific embodiment. The metal region is characterized by a first dimension. The first dimension is less than a second dimension. The second dimension is a dimension of a second metal region formed in the resistive switching material upon application of the first voltage in the absence of the thickness of dielectric material. In a specific embodiment, the first dimension is less than about 10 nm. In a preferred embodiment, the thickness of dielectric material is characterized by a thickness less than about 5 nm.

In a specific embodiment, a method of forming a non-volatile memory device is provided. The method includes providing a semiconductor substrate having a surface region. A first dielectric material is formed overlying the surface region of the semiconductor substrate. The method includes forming a first electrode structure overlying the dielectric material and forming a resistive switching material comprising an amorphous silicon material overlying the first electrode. A second electrode comprising a metal material is formed overlying the resistive switching material. In a specific embodiment the method includes forming a thickness of second dielectric material disposed between the second electrode and the resistive switching layer. The thickness of second dielectric material is configured to electrically breakdown in a localized region upon application of a first voltage to the second electrode. The localized breakdown forms an opening region in a portion of the thickness of second dielectric material to cause a first metal region to form in the portion of the thickness of second dielectric material and in a vicinity of the second electrode from the metal material in a portion of the resistive switching material. The opening region has a first dimension no greater than about 10 nm.

Many benefits can be achieved by ways of the present invention over convention techniques. The present invention allows a metal region formed in the resistive switching material having a reduced cross sectional area. The reduced cross sectional area allows for an reduction of forming voltage, and a reduction in off-state leakage current. Additionally, a thinner metal material can be used to facilitate etching of the metal material. Depending on the embodiment, one or more of these benefits can be achieved. One skilled in the art would recognize other variations, modifications, and alternatives.

SUMMARY OF THE DRAWINGS

FIGS. 1 and 2 are simplified diagrams illustrating conduction path in a conventional resistive switching device.

FIG. 3 is a simplified diagram illustrating a resistive switching device according to an embodiment of the present invention.

FIG. 4 is a simplified diagram illustrating an operation step of the resistive switching device according to an embodiment of the present invention.

FIG. 5 is a simplified flow diagram illustrating the operation step in FIG. 4 of the resistive switching device according to an embodiment of the present invention.

FIG. 6 illustrates a comparison of switching behaviors of the conventional resistive switching device and present inventive switching device.

FIG. 7 illustrates a comparison of off state currents of the conventional resistive switching device and present inventive resistive switching device.

FIG. 8 is a simplified energy bandgap representation of the conventional resistive switching device.

FIG. 9 is a simplified energy bandgap representation of the resistive switching device according to an embodiment of the present invention.

FIG. 10 is a simplified diagram of an interfacial property of the conventional resistive switching device.

FIG. 11 is a simplified diagram exemplifying an interfacial property of the resistive switching device according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PRESENT INVENTION

The present invention is related to switching devices. More particularly, the present invention provides a resistive switching device characterized by a well controlled electroforming process and a low leakage current. Embodiments of the present invention have been applied to fabrication and operation of a resistive random access memory device. But it should be recognized that the present invention can have a much broader range of applicability.

Due to the explosive growth in consumer devices, there is an ever increasing demand for memory device density. Data storage of current non-volatile memory devices are based on charges stored in a floating gate or a dielectric layer. Scaling of these devices is limited as these devices usually require a transistor device coupled to a memory cell. Further down scale of transistors may not be possible due to short channel effects and others.

Resistive switching in an amorphous silicon based resistive random access memory (RRAM) is enabled by a conductive path caused by metal particles formed from a metal electrode in the amorphous silicon material. The conduction path includes a metal region and a filament structure. The metal region is formed when an electroforming voltage is applied to the one of the electrodes of an as-fabricated device. The formation of the metal region is mainly dependent on metal diffusion from an electrode into the switching material. The metal region has a size that depends at least on a contact area between the electrode and the switching element. The filament structure is allowed to extend or contract depending on polarity of an operating voltage applied. The length of the filament structure is primarily depending on an electric field as a result of the applied operating voltage and is independent of the contact region between the electrode and the switching material. Device failure can often occur due to excessive extension of the metal region by diffusion, which is not controllable. To prevent such failure, metal material diffusion after electroforming needs to be suppressed and device operation (read, write, or erase) should be carried out by control of the electric field, or by the respective operating voltage.

Embodiments according to the present invention provide a method and device structure to control the metal region and the filament structure for writing, for reading, and for erasing by providing a controlled conductive path in the switching material from the metal particles. The resulting device has a desirable endurance characteristic for repeated cycling. One skilled in the art would recognize other variations, modifications, and alternatives.

FIG. 1 is a simplified diagram illustrating a conventional switching device structure 100. As shown, the convention switching device includes a top electrode 102, a bottom electrode 104, and a switching material 106 sandwiched between the top electrode and the bottom electrode. The top electrode can have a portion that includes a metal material. For the switching element using an amorphous silicon material, the metal material can be silver, platinum, palladium, or other suitable metal materials having a suitable diffusivity characteristic in the amorphous silicon material. As shown, upon application of an electroforming voltage 112, a metal region 108 is formed in the switching material and in contact with the top electrode. The metal region is formed largely by a diffusion mechanism, assisted by an electric field resulting from the electroforming voltage. As shown, the metal region and'has a contact area 110 about the same as the top electrode.

FIG. 2 illustrates growth of the metal region in the switching material for the conventional resistive switching device. The diffusion of the metal material from the top electrode into the switching material is assisted by the electroforming voltage and results in a continuous metal region. As the metal region grows, an end region of the metal region becomes sharper and closer to the bottom electrode. Once the end region is sharp enough and close enough to the bottom electrode, the electric field would have a much greater effect on the metal region growth than diffusion. An illustration of the continuous growth of the metal region by diffusion is illustrated in FIG. 2( a). As in FIG. 2, a filament structure 202 is formed by hopping of a metal particle from a defect site to the next defect site in the amorphous silicon material upon application of a suitable voltage. Therefore formation of the filament structure is due to the presence of the electric filed and aided by diffusion in contrast to the metal region growth. The metal region including the filament structure form a conductive path for the switching device.

Referring again to FIG. 2, filament structure 202 is characterized by a length that determines a resistance of the switching device. Ideally, the length should extend or contract only upon application of an operating voltage, such as read, write, or erase. As diffusion of metal particles cannot be controlled, device failure occurs if the metal region continues to expand during cycling and eventually in contact with the bottom electrode. Therefore, suppression of diffusion of the metal particles is desirable after formation of the metal region so that the filament is controlled only by applied voltage or electric field.

Referring to FIG. 3, a non-volatile switching device structure 300 according to an embodiment of the present invention is provided. The device includes a first electrode 302, a second electrode 304 and a switching material 306. As shown, the device includes a dielectric layer 308 disposed between the top electrode and the switching material in a specific embodiment. The dielectric material can be a common dielectric material used in CMOS processing such as silicon oxide, silicon nitride, silicon oxynitride, hafnium oxide, aluminum oxide, and others. The dielectric material is preferably characterized by a thickness less than about 10 nm and can be about 5 nm to 10 nm in a specific embodiment. The switching material comprises an amorphous silicon material in a specific embodiment. The second electrode has a first portion that includes a metal material in contact with the dielectric layer in a specific embodiment. The metal material can be a silver material in a specific implementation. Other metal materials can also be used. These other metal materials can include platinum, palladium, nickel, aluminum, and others. The metal material is preferably characterized by a suitable diffusivity in the amorphous silicon material. The second electrode further includes a second portion for a wiring structure for the non-volatile switching device in a specific embodiment. The first electrode can include a conductive material such as copper, aluminum, or tungsten and can further include a diffusion barrier material or an adhesion material depending on the application.

In a certain embodiments, the non-volatile switching device can include a buffer layer disposed in between the first electrode and the switching material. The buffer layer is provided to control interfacial characteristic between the switching material and the bottom electrode. In other embodiments, this buffer layer may not be needed. For an amorphous silicon switching material, a p+ polysilicon material is found to be a suitable buffer layer. The polysilicon material also has an advantage of a common material used in conventional CMOS fabrication.

FIGS. 4 and 6( a) are simplified diagrams illustrating operations and switching characteristics of non-volatile switching device 300 according to embodiments of the present invention. As shown in FIG. 4, the as fabricated switching device is subjected to an electroforming process. The electroforming process includes applying a positive voltage 402 to the second electrode to cause a metal region to form in the switching material and to change a resistance of the switching material. The electroforming forming voltage can range from about 4 volts to about 6 volts for an amorphous silicon switching material and silver as the conductive material. The electroforming voltage initially causes a local electric breakdown in the dielectric layer and forms an opening region 404 in dielectric layer as shown. In a specific embodiment, the opening region can have a dimension ranging from about 10 nm to about 50 nm depending on the thickness of the dielectric layer and the electroforming voltage applied. The local breakdown of the dielectric layer causes an increase in current density in the opening region and further causes an increase in temperature locally, in vicinity of the opening region. This increase in temperature enhances diffusion of metal through the opening region and an increase in electric field in a vicinity of the opening region. The increase in electric field is also accelerated due to a small metal region formed from the opening region. A summary of the mechanism of metal region formation is illustrated in FIG. 5. The opening region limits the dimension of the metal region formed in the switching material in a specific embodiment. In a specific embodiment, the metal region has a size that is about the same as the opening region. This reduced dimension of metal region allows for further scale down of the switching device in a specific embodiment.

As shown in FIG. 6( a), the onset of metal region 602 formation starts in the opening region in the dielectric layer. The reduced diameter of the metal region enables an enhanced electric field in the switching material in a vicinity of the opening region causing a higher growth rate for the metal region. The opening region also limits the amount of metal particles formed in the switching material allowing for a metal region having a shorter length 604 to form in a specific embodiment.

In contrast to the conventional switching device without the interposing dielectric layer as illustrated in FIG. 6( b). As the volume of the metal region is relatively large in the conventional switching device absent of the dielectric layer, the number of metal particles is a lot higher. An expansion of the metal region towards the first electrode has to occur to have large enough electric field for the filament structure to form. In this process, the metal region may be in contact with the bottom electrode and shorting the electrodes, resulting in device failure even during the electroforming process. Accordingly, enhanced electric field from a smaller metal region accelerates the growth of the metal region and the filament structure. Growth of the metal region or the filament structure resulting from diffusion is therefore suppressed.

Referring again to FIG. 6( a), as the filament structure is shorter in the resistive switching device, extension of the filament structure in the amorphous silicon material would not be as much and less likely to reach the bottom electrode for a same operating voltage in a specific embodiment. This improves endurance for repeated operation cycling in a specific embodiment

FIG. 7( a) and FIG. 7( b) compare off state currents for a resistive switching device having the dielectric layer and a conventional resistive switching device. As shown in FIG. 7( b), as the metal region is much greater in volume in conventional switching device, leakage current at off state is large as there are more leakage current paths, for example, I_(L2) from the metal region to the bottom electrode and I_(L1) from the second electrode to the first electrode in addition to an off-state current path I_(off) from the metal region or the filament structure to the first electrode. As the dielectric material has a much larger energy bandgap than the second electrode material, leakage current from the second electrode to the first electrode is largely suppressed.

FIG. 8 illustrates an energy bandgap diagram of a conventional switching device structure. The energy bandgap Eg of amorphous silicon material is about 1.7 eV. Electrons from the first electrode can gain enough energy to overcome the energy barrier under just a slight positive bias applied to the second electrode and cause leakage current to flow from the second electrode to the first electrode at least through leakage current paths I_(L1) as shown.

Referring now to FIG. 9. A dielectric material or an insulator material has a much higher bandgap than an amorphous silicon material. For example, silicon dioxide has a bandgap of about 9 eV. Leakage currents flowing from the second electrode to the first electrode are effectively blocked by the dielectric layer except along the conductive path comprising the metal region and the filament as shown in FIG. 9. In a specific embodiment, the dielectric material layer has a thickness of less than about 10 nm to allow breakdown at a reasonable low voltage allowing the filament structure to form in the switching material. At a read voltage of about 0.5 volt to 1.0 volt, electron tunneling through the dielectric layer of thickness between 5 nm and 10 nm is insignificant, that is, leakage current flowing from the second electrode to the first electrode is greatly suppressed, or non-existent.

Referring to FIG. 10, as the metal particles are formed in defect sites of the amorphous silicon material, a high density of defect sites in amorphous silicon material would form a high density of metal particles. Due to material mismatch, the number of defect sites in an interface region 1002 formed from the amorphous silicon material and the first electrode material is high. A high number of metal particles are trapped in the interface region and causes electrical connection between the top electrode and the bottom electrode and device failure. A buffer layer is usually provided in between the amorphous silicon material and the bottom electrode to prevent excessive metal particles to form. The buffer layer would have to be engineered to have a desirable characteristic to allow for proper switching of the device. That is the buffer layer needs to have a suitable thickness and a suitable conductivity, which can be different for a different thickness and defect characteristics of the amorphous silicon material. This results in a narrow process window for device fabrication.

When the metal region is restricted to a small region as shown in FIG. 11 according to embodiments of the present invention, the number of metal particles formed in filament structure is also limited. As operating voltages (read write, or erase) are lower than the electroforming voltage, the metal region would not expand under operation condition and only the filament structure expands or retracts. The filament structure can thus be better controlled. Under such condition, no metal particles are directly formed on the first electrode and a buffer layer may not be necessary, which enable a simpler device design and fabrication.

Additionally, in the presence of the dielectric layer between the second electrode and the amorphous silicon material, the metal region formed in the amorphous silicon material is reduced. Only a small amount of metal material is required to present in the second electrode for the purpose of changing the resistance of the amorphous silicon material. The dielectric layer interposed between the second electrode and the amorphous silicon material thus provides a mechanism for a small metal region to form. Moreover, certain metal material used, for example, silver, may not be commonly used in CMOS processing. Silver processing may not be entirely compatible with present semiconductor device fabrication. Therefore a smaller amount of silver used would cause less contamination, for example, during second electrode etch.

In a specific embodiment, a method of forming a non-volatile memory device may be summarized as follows:

1. providing a semiconductor substrate having a surface region, the semiconductor substrate can be a single crystal silicon, a silicon germanium material, or a silicon on insulator (SOI) substrate, the semiconductor substrate comprises one or more transistor devices for controlling circuitry for the device;

2. forming a first dielectric material overlying the surface region of the semiconductor substrate, the first dielectric material comprises a silicon oxide, a silicon nitride, a low K dielectric, a high K dielectric, or a silicon oxide on silicon nitride on silicon oxide stack;

3. forming a first electrode structure overlying the dielectric material, the first electrode structure can be tungsten, copper, aluminum, or other suitable conductive material, including a combination.

2. forming a resistive switching material comprising an amorphous silicon material overlying the first electrode structure;

3. forming a thickness of second dielectric material having a thickness of about 5 nm or less overlying the resistive switching layer, the thickness of second dielectric material is selected from: silicon dioxide, silicon nitride, hafnium oxide, aerogel, and aluminum oxide, the thickness of second dielectric material can be formed using techniques such as chemical vapor deposition (including low pressure chemical vapor deposition, plasma enhanced chemical vapor deposition, and others), the thickness of second dielectric material is caused to electrically breakdown in a localized region upon application of an electroforming voltage to form an opening region in a portion of the thickness of second dielectric material; and

4. forming a second electrode comprising at least a metal material overlying the resistive switching material; the metal material can be silver, platinum, palladium or nickel, or a combination thereof, the second electrode further comprises a portion for a wiring material selected from tungsten, copper, and aluminum.

The above sequence provides a method for forming a non-volatile resistive switching device according to an embodiment of the present invention. Depending on the applications, one or more steps may be added, one or more steps may be omitted, one or more steps may be provided in a different sequence. One skilled in the art would recognize other variations, modifications, and alternatives.

Though the present invention has been described using various examples and embodiments, it is also understood that the examples and embodiments described herein are for illustrative purposes only and that various modifications or alternatives in light thereof will be suggested to persons skilled in the art and are to be included within the spirit and purview of this application and scope of the appended claims. 

1. A non-volatile memory device comprising: a first electrode; a second electrode comprising a metal material; a resistive switching material comprising an amorphous silicon material overlying the first electrode; and a thickness of dielectric material formed between the second electrode and the resistive switching layer, the thickness of dielectric material being configured to electrically breakdown in a region when a first voltage is applied to the second electrode and cause formation of an open region in a portion of the thickness of dielectric material, the open region having a first dimension to allow a first metal region to form within the portion of the thickness of dielectric material and extending in a portion of the resistive switching material from the metal material.
 2. The device of claim 1 wherein the thickness of dielectric material is selected from a group consisting of: silicon dioxide: silicon nitride, hafnium oxide, aerogel, and aluminum oxide.
 3. The device of claim 1 wherein the thickness of dielectric material is formed by a process selected from a group consisting of: a plasma enhanced chemical vapor deposition process, an atomic layer deposition process, a spin coating process, a plasma process, or a physical vapor deposition process.
 4. The device of claim 1 wherein the thickness of dielectric material has a non-zero thickness of about 5 nm or less.
 5. The device of claim 1 wherein the first voltage is a positive bias applied to the second electrode.
 6. The device of claim 1 wherein the first dimension is less than about 10 nm by 10 nm.
 7. The device of claim 1 wherein the first dimension is less than a second dimension, the second dimension being a second metal region formed in the resistive switching material absent of the thickness of dielectric material.
 8. The device of claim 1 wherein the first voltage comprises an electroforming voltage.
 9. The device of claim 1 wherein the metal material is in contact with the thickness of dielectric material.
 10. The device of claim 1 wherein the metal material is selected from a group of materials consisting of: silver, platinum, palladium, copper or nickel, or a combination thereof.
 11. The device of claim 10 wherein the metal material has a first thickness less than a second thickness, the second thickness being used by a memory device absent of the thickness of dielectric material.
 12. The device of claim 1 wherein the second electrode structure further comprises a portion for a wiring material selected from a group consisting of: tungsten, copper, aluminum, or a combination thereof.
 13. The device of claim 1 wherein the portion of the thickness of the dielectric material facilitates an increase in local current density and an increase in temperature in the first metal region upon application of the first voltage.
 14. The device of claim 13 wherein the increase in temperature facilitates the metal material to diffuse into the resistive switching material to cause an increase in electric field in the switching material.
 15. The device of claim 1 further characterized by a first leakage current at an off state, wherein the first leakage current is lower that a second leakage current associated with the device in absent of the thickness of dielectric layer.
 16. The device of claim 1 wherein the first metal region further comprises a filament structure extending towards the first electrode upon application of a second voltage.
 17. The device of claim 16 wherein the filament structure is characterized by a length dependent substantially upon a polarity and an amplitude of the second voltage and substantially independent from a diffusion characteristic of the metal material in the resistive switching material.
 18. A method of forming a non-volatile memory device, comprising: providing a semiconductor substrate having a surface region; forming a first dielectric material overlying the surface region of the semiconductor substrate; forming a first electrode structure overlying the first dielectric material; forming a resistive switching material comprising an amorphous silicon material overlying the first electrode; and forming a second electrode structure comprising a metal material overlying the resistive switching material, wherein a second dielectric material is formed between the second electrode and the resistive switching material, wherein a thickness of the second dielectric material is configured to electrically breakdown in a localized region by applying a first voltage to the second electrode to form an open region in a portion of the thickness of the second dielectric material, and wherein the open region facilitates a first metal region to form in the portion of the thickness of the second dielectric material and in a portion of the resistive switching material from the metal material in response to the first voltage.
 19. The method of claim 18 wherein the semiconductor substrate comprises a single crystal silicon, a silicon germanium material, or a silicon on insulator (SOI) substrate.
 20. The method of claim 18 wherein the semiconductor substrate comprises one or more transistor devices for controlling circuitry associated with the device.
 21. The method of claim 18 wherein the first dielectric material comprises a silicon oxide, a silicon nitride, a low K dielectric, a high K dielectric, or a silicon oxide on silicon nitride on silicon oxide stack.
 22. The method of claim 18 wherein the first electrode structure comprises tungsten, copper, aluminum, or a doped semiconductor material.
 23. The method of claim 18 further comprises forming a buffer material comprising a semiconductor material interposed between the first electrode structure and the amorphous silicon material to control an interfacial defect level between the first electrode and the amorphous silicon material, wherein the semiconductor material comprises a material selected from a group consisting of: a p+ polysilicon material and a p+ doped semiconductor material.
 24. The method of claim 18 wherein the thickness of second dielectric material is selected from a group consisting of: silicon dioxide, silicon nitride, hafnium oxide, aerogel, and aluminum oxide.
 25. The method of claim 18 wherein the first voltage is an electroforming voltage.
 26. The method of claim 18 wherein the metal material is selected from a group consisting of: silver, platinum, palladium, copper or nickel, or a combination thereof.
 27. The method of claim 18 wherein the second electrode further comprises a portion for a wiring material selected from a group consisting of: tungsten, copper, and aluminum.
 28. The method of claim 18 wherein the thickness of second dielectric material has a non-zero thickness of about 5 nm or less.
 29. The method of claim 18 wherein the thickness of the second dielectric material is approximately 5 nm. 